Contact-adhesives in different packages, ready for your brand
Filter by chemistry, packaging and application to find the right base product for your private label. Every product can be customised with your label, colour and packaging. Looking for something more specific? Our in-house laboratory can develop or adapt a contact-adhesive to meet the requirements of your application.
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Type
Use
Markets
Chemistry
Packaging i Below you will find an overview of the most commonly used packaging options. BondPartner offers a high degree of flexibility and can tailor both the packaging and fill volume to your specific requirements and applications.
Industry i Below you will find an overview of the most common industries in which BondPartner operates. Our contact adhesives are widely used across a broad range of sectors. Is your industry not listed? Please feel free to contact us. We will be happy to advise you on the right contact adhesive and, if necessary, tailor the formulation to your specific application.
Substrate i BondPartner contact adhesives are suitable for use on virtually all common substrates. Is your specific substrate not listed? Please feel free to contact us. We will be happy to advise you on the most suitable solution and, if necessary, explore the possibilities in our laboratory to tailor the formulation to your specific substrate.
Heat-resistance

Plasticiser-Free
Solvent-based
- Plasticiser-free — safe on sensitive substrates
- Water resistant
- Heat resistant up to +100°C

Heat Resistant
Solvent-based
- Heat resistant up to +110°C
- High initial tack
- Extremely strong bond

Low VOC
Polyurethane-based
- Low VOC formulation
- Full cure in ±1 hour
- Strong final adhesion on EPDM

Water-Resistant
Solvent-based
- Water-resistant once cured
- Very high solids content
- Suitable for European and American EPDM

Bio-Based
Bio-Solvent-Based
- Bio-based, low-fume formulation
- Heat resistant up to +110°C
- Extremely strong bond

Two-Sided Application
Solvent-based
- High solids content
- Fast drying
- DCM-free formulation

High Solids
Solvent-based
- Very high solids content (40%)
- Heat resistant up to +130°C
- Bonds nearly any material on any substrate

Seam & Splice Bonding
Solvent-based
- Purpose-built for EPDM overlaps and seams
- High initial tack
- Works with EPDM seam sealers

Water-Based
Water-based
- Water-based formulation
- Low odour
- For absorbent substrates
