Contact-adhesives in different packages, ready for your brand
Filter by chemistry, packaging and application to find the right base product for your private label. Every product can be customised with your label, colour and packaging. Looking for something more specific? Our in-house laboratory can develop or adapt a contact-adhesive to meet the requirements of your application.
Filters
Groups
Packaging
Type
Use
Markets
Chemistry
Packaging Below you will find an overview of the most commonly used packaging options. BondPartner offers a high degree of flexibility and can tailor both the packaging and fill volume to your specific requirements and applications.
Industry Below you will find an overview of the most common industries in which BondPartner operates. Our contact adhesives are widely used across a broad range of sectors. Is your industry not listed? Please feel free to contact us. We will be happy to advise you on the right contact adhesive and, if necessary, tailor the formulation to your specific application.
Substrate BondPartner contact adhesives are suitable for use on virtually all common substrates. Is your specific substrate not listed? Please feel free to contact us. We will be happy to advise you on the most suitable solution and, if necessary, explore the possibilities in our laboratory to tailor the formulation to your specific substrate.
Heat-resistance
High Solids
Polyurethane-based
- Very high solids content (81%)
- Fast-drying PU adhesive
- For fleece-backed EPDM, PVC & TPO membranes
Heat Resistant
Solvent-based
- Heat resistant up to +110°C
- High initial tack
- Extremely strong bond
For Insulation and carpets
Solvent-based
- One-sided application — economical in use
- Fast tack in 3–4 minutes
- Ideal for soft, porous materials
High Solids
Solvent-based
- Very high solids content (40%)
- Heat resistant up to +130°C
- Bonds nearly any material on any substrate
Bio-Based
Bio-Solvent-Based
- Bio-based, low-fume formulation
- Very high solids content (45%)
- Highest heat resistance in the range — +140°C
Two-Sided Application
Solvent-based
- High solids content
- Fast drying
- DCM-free formulation
Heat Resistant
Solvent-based
- Very high solids content
- Heat resistant up to +110°C
- High initial tack
Seam & Splice Bonding
Solvent-based
- Purpose-built for EPDM overlaps and seams
- High initial tack
- Works with EPDM seam sealers
Low VOC
Polyurethane-based
- Low VOC formulation
- Full cure in ±1 hour
- Strong final adhesion on EPDM